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Anti-drop, insulation and precise fit: The core of injection molding process for plastic components of electronic devices

2025-05-29 15:07:29
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Today, with the high popularity of electronic products such as smart phones, laptops and smart wearable devices, plastic components have become an indispensable part of electronic devices. From mobile phone casings, laptop keyboard frames to smartwatch cases, these seemingly insignificant plastic parts carry the important mission of protecting the internal precision components and ensuring the safe operation of the equipment. Anti-drop, insulation and precise fitting, these three core performances directly determine the reliability and service life of electronic devices. As the mainstream production method of plastic components for electronic devices, the injection molding process is deeply innovating and optimizing its technical core around these three performances.


Anti-drop: Building a "protective barrier" for Electronic devices


Electronic devices are bound to encounter unexpected situations such as drops and collisions during daily use. The anti-drop performance of plastic components is directly related to the safety of core components such as chips and screens inside the device. The injection molding process, through the dual effects of material selection and structural design, endows plastic components with excellent impact resistance.


At the material level, the injection molding process selects high-toughness plastic materials based on the usage scenarios of electronic devices. For instance, polycarbonate (PC), which is commonly used in mobile phone casings, has excellent impact resistance. Even in a low-temperature environment of -40 ℃, it can still maintain good toughness and effectively buffer the impact force when dropped. The alloy material of acrylonitrile butadiene styrene (ABS) and PC (PC/ABS) combines the easy processability of ABS and the impact resistance of PC, and is widely used in components such as notebook computer shells and tablet computer cases. For small wearable devices such as smartwatches, elastomer materials like thermoplastic polyurethane (TPU) are also added during injection molding. The elastic deformation of the material absorbs impact force, reducing the risk of device damage.


The optimization of structural design is another key to enhancing the anti-drop performance of injection molding processes. Through computer-aided design (CAD) and simulation technology, injection molds can precisely replicate plastic structures with reinforcing ribs and buffer grooves. For instance, the injection-molded parts of the middle frame of a mobile phone are designed with arc transitions and internal reinforcing ribs at the corners. When the device drops, the reinforcing ribs can disperse the impact force, and the arc structure reduces stress concentration. The plastic part of the base of the smart speaker will adopt a hollow grid structure, which not only reduces the weight but also achieves a buffering effect through the elastic deformation of the grid. In addition, the "one-piece molding" technology of injection molding can reduce the gaps between component joints and prevent the disassembly of the equipment due to the breakage of the joints when it drops.


Insulation: The "Safety line" for Electronic devices


The interior of electronic devices is filled with complex circuits and currents. The insulation performance of plastic components is the core guarantee for preventing safety hazards such as short circuits and leakage. The injection molding process builds a reliable insulating barrier by controlling the insulating properties of materials and improving process accuracy.


The insulating performance of materials is fundamental. Injection molding processes will give priority to plastic materials with high volume resistivity and excellent dielectric strength. For instance, polytetrafluoroethylene (PTFE) has excellent insulating properties and can maintain a stable dielectric constant even in high-temperature and high-humidity environments. It is often used as insulating bushings for precision electronic components. Polyoxymethylene (POM) has become the preferred material for internal gears, sliders and other transmission components in electronic devices due to its excellent insulation and wear resistance. For scenarios that require both insulation and flame retardancy, such as router casings and plastic parts of chargers, modified plastics with flame retardants added are selected during injection molding, such as flame-retardant grade PC/ABS alloys. These can not only prevent current conduction but also suppress combustion at high temperatures.


The influence of process accuracy on insulation performance cannot be ignored either. During the injection molding process, if there are defects such as bubbles and pinholes on the surface of the plastic part, it will cause local electric field concentration and damage the insulation performance. Therefore, the injection molding process ensures that the plastic material is fully filled and densely formed in the mold by optimizing the injection pressure, holding time and cooling rate. For instance, when manufacturing the plastic casing for mobile phone chargers, a high-pressure and low-speed injection method is adopted to reduce the air drawn in during the material flow process and prevent the formation of bubbles. Meanwhile, through precise temperature control, the plastic parts are cooled slowly to reduce the risk of micro-cracks caused by internal stress and ensure the integrity of the insulation layer.


Precision Fit: The "Invisible Link" for the Efficient Operation of Electronic Devices


The trend of miniaturization and integration of electronic devices has put forward extremely high requirements for the dimensional accuracy and assembly tolerance of plastic components. The injection molding process achieves precise matching of plastic parts with other components through the improvement of mold precision and the precise control of process parameters.


Precision processing of molds is the prerequisite. The cavity size and surface roughness of injection molds directly determine the precision of plastic parts. For high-precision components such as the camera decorative rings of smart phones and the keyboard keys of laptops, the processing accuracy of molds needs to be controlled within ±0.005mm, which relies on the application of high-precision equipment such as five-axis machining centers and electrical discharge forming. The design of the parting surface of the mold is also of vital importance. By optimizing the fit of the parting surface, flash and burrs on plastic parts can be reduced, ensuring seamless connection during assembly. For instance, the injection molded parts of the watch case and cover of a smartwatch adopt a stepped design for their parting surfaces. Combined with high-precision guide pins and guide sleeves for positioning, the assembly gap between the two is controlled below 0.01mm, which not only ensures waterproof performance but also enhances the consistency of appearance.


The fine adjustment of process parameters is the key to achieving precise adaptation. During the injection molding process, even minor fluctuations in parameters such as temperature, pressure and time can lead to dimensional deviations of plastic parts. Therefore, modern injection molding processes mostly adopt closed-loop control systems to monitor and adjust process parameters in real time. For instance, when manufacturing the plastic brackets for mobile phone mainboards, the temperature of the molds is monitored in real time by infrared thermometers, and the injection pressure is precisely controlled by servo motors, which keeps the shrinkage rate of the plastic parts stable within 0.5%. During the pressure-holding stage, a segmented pressure-holding technology is adopted. The pressure is dynamically adjusted based on the cooling and shrinkage characteristics of the material to ensure the dimensional stability of the plastic parts. In addition, the precise inspection process after injection molding is indispensable. Through equipment such as three-coordinate measuring machines and optical image measuring machines, full-size inspections of plastic parts are carried out to screen out products that do not meet the tolerance requirements, ensuring precise alignment during assembly.


From the thin and light body of smart phones to the stable operation of smart home appliances, the reliability of electronic devices cannot do without the three core performances of plastic components. The injection molding process, through the coordinated efforts of material innovation, structural optimization and precision control, continuously breaks through the technical boundaries of anti-drop, insulation and precise matching. In the future, with the further development of 5G devices, wearable electronics and other products, injection molding processes will continue to evolve towards higher precision and better performance, providing solid manufacturing support for the innovative upgrading of electronic devices.


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